Program overview

MONDAY AFTERNOON, 6 OCTOBER 1997

13:30 CM1.01 Study of Plasma Transport Around Dust Particles with Complex Shapes

Eric R. Keiter, Mark J. Kushner (University of Illinois - Urbana/Champaign)

13:45 CM1.02 Collective sheaths around dust ensembles in a helium glow discharge

B.N. Ganguly, A. Garscadden, P. Bletzinger, P.D. Haaland (Wright Laboratory,WPAFB,OH)

14:00 CM1.03 Electron Transport in CF_4 by using DNP of the Boltzmann equation

M. Kurihara, N. Nakano, T. Makabe (Keio University Yokohama, Japan)

14:15 CM1.04 Boundary Effects on Arrival-Time-Spectra (ATS) Measurements of Electron Swarms

Hiroyuki Date, P.L.G. Ventzek (Hokkaido University), K. Kondo (Anan College of Technology), H. Hasegawa (Tomakomai National College of Technology), M. Shimozuma, H. Tagashira (Hokkaido Uiversity)

14:30 CM1.05 Spatio-Temporal Development of Electron Swarms in Gases

Hirotake Sugawara, Y. Sakai (Hokkaido University), H. Tagashira, K. Kitamori (Hokkaido Institute of Technology)

14:45 CM1.06 Kinetic description of large-scale low pressure glow discharges

Uwe Kortshagen (), Brian Heil (University of Minnesota, Dept. of Mech. Engineering)

15:00 CM1.07 The self-separation of the multi-component plasma into regions with different ion composition

I.D. Kaganovich (University Bochum, Germany), L.D. Tsendin (St.Petersburg Technical State University, Russia)

15:15 CM1.08 Fully self-consistent kinetic Convected Scheme simulation of a positive column discharge

G. J. Parker (Lawrence Livermore National Laboratory), W. N. G. Hitchon (University of Wisconsin- Madison)

15:30 CM1.09 A Self-Consistent Energy-Resolved Model of the D. C. Positive Column

Edward A. Richley (Xerox PARC)

15:45 CM1.10 Nonequilibrium Positive Column.

J. H. Ingold (One Bratenahl Place #610, Bratenahl, OH 44108)

13:30 CM2.01 Evolving Window Factor Analysis (EWFA) and Multiple Curve Resolution (MCR): New Techniques for Endpoint and Fault Detection in HDP Oxide Etching

Harold M. Anderson, Ray Forrister (University of New Mexico), Enlian Lu, Qingyun Yang (SEMATECH), Ion C. Abraham, R. Claude Woods (UW-Madison Plasma ERC)

13:45 CM2.02 Ultrahigh-Aspect-Ratio Contact Hole Etching

Naokatsu Ikegami (VLSI R and D Center, Oki Electric Ind. Co., Ltd.)

14:15 CM2.03 Contact Etch Scaling with Contact Dimension

Susan McNevin (Bell Labs, Lucent Technologies)

14:45 CM2.04 Interferometric Lithography for Nanoscale Fabrication

S. R. J. Brueck (Center for High Technology Materials, University of New Mexico)

15:15 CM2.05 Process Development for Deposition of Chromium Oxide Using Plasma Source Ion Implantation

Shamim Malik (University of Wisconsin-Madison)

15:30 CM2.06 Simulation of Plasma Enhanced CVD with Irregular Substrate Geometry

Da Zhang (University of Illinois - Urbana/Champaign), Manoj Dalvie (Becton Dickinson Research Center), Mark J. Kushner (University of Illinois - Urbana/Champaign)

15:45 CM2.07 Simulations of Remote Ar/O_2 and Ar/N_2O Plasmas for Oxide Growth and Interface Treatments

Ron Kinder, Mark J. Kushner (University of Illinois-Urbana/Champaign)